journal article Sep 25, 2003

Development of polymer‐molding‐releasing metal mold surfaces with perfluorinated‐group‐containing polymer plating

Journal of Applied Polymer Science Vol. 90 No. 9 pp. 2549-2556 · Wiley
View at Publisher Save 10.1002/app.12671
Abstract
AbstractThe polymer‐molding‐releasing properties of metal molds were found to be related to the following factors: (1) interfacial chemical bonding between the surfaces of polymers and metal molds and (2) a friction force or friction coefficient between polar substances and/or low‐molecular‐weight components in the polymers and physical factors on mold surfaces. We theoretically and experimentally confirmed that metal molds with good polymer‐molding‐releasing properties had very small surface free energies. We also proved that the surface free energies in the resulting polymer moldings were lower than before shaping. The molding releasing properties improved with decreasing friction force and friction coefficient between the surface of polymers and metal molds and with decreasing surface free energy. To obtain metal molds with lower surface free energies, we developed a polymer plating method with perfluorinated‐group‐containing triazine dithiol. The Metal mold treated by polymer plating had lower critical surface tension (7.5 mJ/m2) than Teflon (18 mJ/m2), indicating that the surface consisted of CF3− groups. The treated mold showed excellent durability in its releasing properties, which was better than that of the untreated mold. This technique was developed for the production of molds for the Fθ lens and the naturally bright focusing screen. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2549–2556, 2003
Topics

No keywords indexed for this article. Browse by subject →

References
17
[4]
Wu S. J Polym Sci Part C: Polym Symp (1971) 10.1002/polc.5070340105
[6]
Mori K Nippon Kagakukaishi (1987)
[8]
Mori K. Hyomen Gijutu (1999)
[17]
Jpn. Pat. H 7–4617.
Metrics
18
Citations
17
References
Details
Published
Sep 25, 2003
Vol/Issue
90(9)
Pages
2549-2556
License
View
Cite This Article
Kunio Mori, Yaeko Sasaki, Hidetoshi Hirahara, et al. (2003). Development of polymer‐molding‐releasing metal mold surfaces with perfluorinated‐group‐containing polymer plating. Journal of Applied Polymer Science, 90(9), 2549-2556. https://doi.org/10.1002/app.12671
Related

You May Also Like

Estimation of the surface free energy of polymers

D. K. Owens, R. C. Wendt · 1969

8,566 citations

Electrospinning of nanofibers

Thandavamoorthy Subbiah, G. S. Bhat · 2005

1,471 citations

EMI shielding: Methods and materials—A review

S. Geetha, K. K. Satheesh Kumar · 2009

1,062 citations