3D printing conductive hydrogel with low modulus and anti‐swelling for customized strain sensors

Chaojie Chen; Guoqing Cui; Yuanlong Li; Li Liu; Guangfeng Wu

doi:10.1002/app.55701

journal article May 14, 2024

3D printing conductive hydrogel with low modulus and anti‐swelling for customized strain sensors

Chaojie Chen Guoqing Cui

Yuanlong Li

Li Liu

Guangfeng Wu

Journal of Applied Polymer Science Vol. 141 No. 30 · Wiley

View at Publisher Save 10.1002/app.55701

Abstract

AbstractDeveloping antiswelling hydrogel that retains their low modulus and has three‐dimensional (3D) printability to application in the biomedical field is a current critical issue. Here, we synthesized 3D printing ink consist of poly(acrylic acid‐acrylamide‐allyloxypolyethyleneglycol) (P(AA‐Am‐APEG)) and nanosilica (SiO2) by free radical polymerization, immersed the hydrogel precursor printed by ink in ferric chloride solution to prepare a low modulus, antiswelling, and conductive hydrogel. In the physical cross‐linking network, the coordination interaction and hydrogen bonds contributed to excellent mechanical properties and nSiO2 regulated rheological behavior of ink. Especially, P(AA‐Am‐APEG) molecular chain was a structure containing of APEG branch chain, which could endow antiswelling (the equilibrium swelling rate was only 7% in deionized water) and low modulus (Young's modulus was less than 100 kPa) to hydrogel. The tensile stress could still maintain 90% of the original value after soaking for 24 h. In addition, the existence of iron and chloride ions provided high sensitive deformation‐dependent conductivity to hydrogel. Therefore, the strategy of controlling the swelling and modulus by branch chains would expand the application of hydrogel in biosensors and other fields.

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References

41

[1]

10.1016/j.colsurfa.2023.131739

[2]

10.1002/smll.202101151

[3]

Advances in flexible organic field-effect transistors and their applications for flexible electronics

Kai Liu, Bang Ouyang, Xiaojun Guo et al.

npj Flexible Electronics 10.1038/s41528-022-00133-3

[4]

10.1021/acsami.1c05661

[5]

10.1039/d0ta08987g

[6]

10.1039/d3mh00399j

[7]

10.1021/acsami.3c00882

[8]

10.1016/j.carbpol.2023.120678

[9]

10.1016/j.jcis.2022.03.037

[10]

10.1016/j.jmst.2023.05.064

[11]

10.1016/j.carbpol.2022.120468

[12]

10.1002/adma.201405022

[13]

10.1021/acs.macromol.7b02653

[14]

10.1002/aenm.201601529

[15]

Fu R. Small Methods (2022)

[16]

10.1016/j.ijbiomac.2022.06.011

[17]

10.1038/s41467-018-03954-x

[18]

10.1002/advs.201903145

[19]

10.1021/acsapm.0c01034

[20]

10.1016/j.progpolymsci.2017.04.001

[21]

10.1039/c9bm00081j

[22]

10.1016/j.polymer.2019.122080

[23]

10.1039/c9tb01155b

[24]

10.1039/c9ta09170j

[25]

10.1016/j.jcis.2022.03.125

[26]

10.1021/acs.macromol.7b00364

[27]

Direct-Ink-Write 3D Printing of Hydrogels into Biomimetic Soft Robots

Yin Cheng, Kwok Hoe Chan, Xiao-Qiao Wang et al.

ACS Nano 10.1021/acsnano.9b06144

[28]

10.1016/j.bioactmat.2021.08.015

[29]

10.1016/j.ijbiomac.2022.08.175

[30]

10.1016/j.carbpol.2021.118114

[31]

10.1016/j.carbon.2023.118037

[32]

Cheng T. Chem. Eng. J. (2022)

[33]

10.1016/j.apsusc.2023.156328

[34]

10.1002/macp.202200272

[35]

10.1002/adhm.202001876

[36]

10.1002/adfm.202100462

[37]

10.1016/j.bioactmat.2023.02.007

[38]

10.1002/admi.202201186

[39]

10.1016/j.ijbiomac.2022.02.030

[40]

10.1088/1758-5090/ac6e87

[41]

10.1016/j.bioadv.2022.213103

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Details

Published: May 14, 2024
Vol/Issue: 141(30)
License: View

Authors

C

Chaojie Chen

School of Chemical Engineering Changchun University of Technology Changchun China

G

Guoqing Cui

School of Chemical Engineering Changchun University of Technology Changchun China

Y

Yuanlong Li

School of Chemical Engineering Changchun University of Technology Changchun China

L

Li Liu

School of Chemical Engineering Changchun University of Technology Changchun China; Engineering Research Center of Synthetic Resin and Special Fiber, Ministry of Education Changchun University of Technology Changchun China

G

Guangfeng Wu

School of Chemical Engineering Changchun University of Technology Changchun China; Engineering Research Center of Synthetic Resin and Special Fiber, Ministry of Education Changchun University of Technology Changchun China

Funding

Jilin Provincial Scientific and Technological Development Program Award: 20220101077JC

Cite This Article

Chaojie Chen, Guoqing Cui, Yuanlong Li, et al. (2024). 3D printing conductive hydrogel with low modulus and anti‐swelling for customized strain sensors. Journal of Applied Polymer Science, 141(30). https://doi.org/10.1002/app.55701

3D printing conductive hydrogel with low modulus and anti‐swelling for customized strain sensors

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