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journal article Apr 17, 2020

Non‐hermetic packaging of biomedical microsystems from a materials perspective: A review

Hao Chong Steve J.A. Majerus Kath M. Bogie ORCID Christian A. Zorman ORCID
MEDICAL DEVICES & SENSORS Vol. 3 No. 6 · Wiley
View at Publisher Save 10.1002/mds3.10082
Abstract
AbstractThe advancement of reliable encapsulation techniques for long‐term implantable biomedical microdevices is of vital importance for the safe and steady operation of implants for chronic applications. Conventional techniques based on titanium or ceramic enclosures, however, cannot meet the packaging requirements of emerging innovations in medical implants due to issues related to scalability, incompatibility with microfabrication processes and challenges with miniaturization. A variety of polymeric materials have been identified for encapsulation of implantable systems, including polyimide, parylene, liquid crystal polymer (LCP), and polydimethylsiloxane (PDMS). These materials are not as hermetic as conventional metal or ceramic packages nor as widely adopted in regulative licensed devices for long‐term implantation. However, studies have shown promising results regarding their potential for long‐term encapsulation, in particular for devices fabricated on polymeric substrates. This review offers a summary of the encapsulation performance of these emerging polymeric materials with a specific focus on their long‐term performance and quantification of their expected lifetime.
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Showing 50 of 153 references

Metrics
23
Citations
153
References
Details
Published
Apr 17, 2020
Vol/Issue
3(6)
License
View
Authors
H
Hao Chong

Department of Electrical, Computer, and Systems Engineering Case Western Reserve University Cleveland OH USA

S
Steve J.A. Majerus

APT Center Louis Stokes VA Medical Center Cleveland OH USA

K
Kath M. Bogie

APT Center Louis Stokes VA Medical Center Cleveland OH USA; Department of Orthopaedics Case Western Reserve University School of Medicine Cleveland OH USA

C
Christian A. Zorman

Department of Electrical, Computer, and Systems Engineering Case Western Reserve University Cleveland OH USA; APT Center Louis Stokes VA Medical Center Cleveland OH USA

Funding
Spinal Cord Injury Research Program, Department of the Army CDMRP Award: W81XWH-17-1-0149
Cite This Article
Hao Chong, Steve J.A. Majerus, Kath M. Bogie, et al. (2020). Non‐hermetic packaging of biomedical microsystems from a materials perspective: A review. MEDICAL DEVICES & SENSORS, 3(6). https://doi.org/10.1002/mds3.10082
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