The effects of multiple‐sized compound fillers on the thermal, electrical, and processing properties of epoxy composites

AbstractThe efficient filling of the multiple‐sized compound fillers can effectively increase the thermal conductivity of the polymer composite. However, determining the specific proportion of the compound fillers with different sizes is hard. This article proposes a random distribution model and the closest packing model to calculate the proportion of the compound fillers and prepare the epoxy composites with different compound fillers. By elaborately designing epoxy composites containing 75 wt% (48 vol%) ternary compound Al2O3 fillers, its thermal conductivity reached 1.640 W/(m·K). In addition, the volume resistivity for all prepared Al2O3/epoxy composites was higher than 1016 Ω cm. Besides, the electrical and dielectric properties of the epoxy composite with multiple‐sized compound fillers were comparable or superior to the composite with single‐sized fillers. Last but not least, the viscosity of the ternary compound Al2O3/epoxy mixture was significantly lower than the single‐sized Al2O3/epoxy mixture, which is beneficial for improving the processability of the epoxy composite. The results of this article will guide the development and utilization of epoxy composites with high thermal conductivities.Highlights
A random distribution model and the closest packing model were proposed.
The thermal conductivity of the designed epoxy composites reached 1.640 W/(m·K).
The compound filler can effectively improve the processability of the composite.

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References

Details

Published: Nov 25, 2023
Vol/Issue: 45(3)
Pages: 2749-2758
License: View

Authors

W

Wei Yang

School of Electrical Engineering and Automation Hefei University of Technology Hefei China

Y

Yushun Zhao

School of Electrical Engineering and Automation Hefei University of Technology Hefei China

Y

Yun Chen

Beijing Institute of Smart Energy Beijing China

J

Jian Qiao

Beijing Institute of Smart Energy Beijing China

W

Weijiang Chen

School of Electrical Engineering and Automation Hefei University of Technology Hefei China; State Grid Co. Ltd. Beijing China

K

Kun Wang

Beijing Institute of Smart Energy Beijing China

C

Chong Zhang

State Grid Smart Grid Research Institute Co. Ltd. Beijing China

X

Xin Chen

State Grid Smart Grid Research Institute Co. Ltd. Beijing China

B

Bin Du

School of Electrical Engineering and Automation Hefei University of Technology Hefei China

Cite This Article

Wei Yang, Yushun Zhao, Yun Chen, et al. (2023). The effects of multiple‐sized compound fillers on the thermal, electrical, and processing properties of epoxy composites. Polymer Composites, 45(3), 2749-2758. https://doi.org/10.1002/pc.27954

The effects of multiple‐sized compound fillers on the thermal, electrical, and processing properties of epoxy composites

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