Stress relaxation behavior of 3501‐6 epoxy resin during cure

Yeong K. Kim; Scott R. White

doi:10.1002/pen.10686

journal article Dec 01, 1996

Stress relaxation behavior of 3501‐6 epoxy resin during cure

Yeong K. Kim Scott R. White

Polymer Engineering & Science Vol. 36 No. 23 pp. 2852-2862 · Wiley

View at Publisher Save 10.1002/pen.10686

Abstract

AbstractEpoxy resins and other thermosetting polymers change from liquids to solids during cure. A precise process model of these materials requires a constitutive model that is able to describe this transformation in its entirety. In this study the viscoelastic properties of a commercial epoxy resin were characterized using a dynamic mechanical analyzer (DMA). Specimens were tested at several different cure states to develop master curves of stress relaxation behavior during cure. Using this experimental data, the relaxation modulus was then modeled in a thermorheologically complex manner. A Prony (exponential) series was used to describe the relaxation modulus. An original model was developed for the stress relaxation times based on similar work by Scherer (16) on the relaxation of glass. Shift functions used to obtain reduced times are empirically derived based on curve fits to the data. The data show that the cure state has a profound effect on the stress relaxation of epoxy. More important, the relaxation behavior above gelation is shown to be quite sensitive to degree of cure.

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206

Citations

22

References

Details

Published: Dec 01, 1996
Vol/Issue: 36(23)
Pages: 2852-2862
License: View

Authors

Cite This Article

Yeong K. Kim, Scott R. White (1996). Stress relaxation behavior of 3501‐6 epoxy resin during cure. Polymer Engineering & Science, 36(23), 2852-2862. https://doi.org/10.1002/pen.10686

Stress relaxation behavior of 3501‐6 epoxy resin during cure

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