Epoxy resin curing by dicyandiamide using model compounds

A. Pfitzmann; K. Schlothauer; M. Fedtke

doi:10.1007/bf00296326

journal article Oct 01, 1991

Epoxy resin curing by dicyandiamide using model compounds

A. Pfitzmann K. Schlothauer M. Fedtke

Polymer Bulletin Vol. 27 No. 1 pp. 59-66 · Springer Science and Business Media LLC

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Published: Oct 01, 1991
Vol/Issue: 27(1)
Pages: 59-66
License: View

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Cite This Article

A. Pfitzmann, K. Schlothauer, M. Fedtke (1991). Epoxy resin curing by dicyandiamide using model compounds. Polymer Bulletin, 27(1), 59-66. https://doi.org/10.1007/bf00296326

Epoxy resin curing by dicyandiamide using model compounds

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