Optimization of embedded cooling for hotspots based on compound plate thermal spreading model

Jianyu Du; Yuchi Yang; Huaiqiang Yu; Xin Yu; Wei Wang; Chi Zhang

doi:10.1016/j.ijheatmasstransfer.2024.125866

journal article Oct 01, 2024

Optimization of embedded cooling for hotspots based on compound plate thermal spreading model

Jianyu Du

Yuchi Yang

Huaiqiang Yu Xin Yu

Wei Wang

Chi Zhang

International Journal of Heat and Mass Transfer Vol. 231 pp. 125866 · Elsevier BV

View at Publisher Save 10.1016/j.ijheatmasstransfer.2024.125866

Topics

No keywords indexed for this article. Browse by subject →

References

33

[1]

Rais-Zadeh "Gallium nitride as an electromechanical material" J. Microelectromech. Syst. (2014) 10.1109/jmems.2014.2352617

[2]

Bar-Cohen "Embedded cooling for wide bandgap power amplifiers: a review" J. Electron. Packag. (2019) 10.1115/1.4043404

[3]

G. David Via, GaN reliability-where we are and where we need to Go, n.d.

[4]

Z. He, Y. Yan, Z. Zhang, Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review, Energy 216 (2021). https://doi.org/10.1016/j.energy.2020.119223. 10.1016/j.energy.2020.119223

[5]

IEEE Staff, 2013 IEEE compound semiconductor integrated circuit symposium (CSICS)., IEEE, 2013.

[6]

Cho "Impact of copper through-package vias on thermal performance of glass interposers" IEEe Trans. Compon. PackAging Manuf. Technol. (2015) 10.1109/tcpmt.2015.2450731

[7]

Zhao "A review of thermoelectric cooling: materials, modeling and applications" Appl. Therm. Eng. (2014) 10.1016/j.applthermaleng.2014.01.074

[8]

Chen "Thermoelectric coolers: infinite potentials for finite localized microchip cooling" J. Mater. Sci. Technol. (2022) 10.1016/j.jmst.2021.12.069

[9]

Chein "Thermoelectric cooler application in electronic cooling" Appl. Therm. Eng. (2004) 10.1016/j.applthermaleng.2004.03.001

[10]

Zhang "Enhanced capillary-fed boiling in copper inverse opals via template sintering" Adv. Funct. Mater. (2018)

[11]

A. Bar-Cohen, Chapter 16 towards embedded cooling-Gen 3 thermal packaging technology, n.d. www.worldscientific.com.

[12]

High-performance heat sinking for VLSI

D.B. Tuckerman, R.F.W. Pease

IEEE Electron Device Letters 10.1109/edl.1981.25367

[13]

Jung "Embedded cooling with 3D manifold for vehicle power electronics application: single-phase thermal-fluid performance" Int. J. Heat. Mass Transf. (2019) 10.1016/j.ijheatmasstransfer.2018.10.108

[14]

Yang "Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips" Int. J. Heat. Mass Transf. (2022) 10.1016/j.ijheatmasstransfer.2022.123340

[15]

van Erp "Co-designing electronics with microfluidics for more sustainable cooling" Nature (2020) 10.1038/s41586-020-2666-1

[16]

Zhang "Manipulating thin film boiling to achieve record-breaking high heat flux" Int. J. Heat. Mass Transf. (2024) 10.1016/j.ijheatmasstransfer.2024.125308

[17]

Zheng "Development of a hierarchical microchannel heat sink with flow field reconstruction and low thermal resistance for high heat flux dissipation" Int. J. Heat. Mass Transf. (2022) 10.1016/j.ijheatmasstransfer.2021.121925

[18]

Pi "A fast and accurate temperature prediction method for microfluidic cooling with multiple distributed hotspots" Int. J. Heat. Mass Transf. (2018) 10.1016/j.ijheatmasstransfer.2018.07.127

[19]

(2017)

[20]

Hua "Thermal spreading resistance in ballistic-diffusive regime for GaN HEMTs" IEEe Trans. Electron. Devices (2019) 10.1109/ted.2019.2922221

[21]

Shen "Spectral thermal spreading resistance of wide-bandgap semiconductors in ballistic-diffusive regime" IEEe Trans. Electron. Dev. (2022) 10.1109/ted.2022.3168798

[22]

Dang "A detailed thermal resistance network analysis of FCBGA package" J. Thermal Sci. (2024) 10.1007/s11630-023-1903-y

[23]

(2008)

[24]

Mendes "Where from and where to?" Materials. (2022) 10.3390/ma15020415

[25]

M.E. Steinke, S.G. Kandlikar, ICMM2004-xxxx single-phase heat transfer enhancement techniques in microchannel and minichannel flows, 2004. http://www.asme.org/about-asme/terms-of-use. 10.1115/icmm2004-2328

[26]

W. Li, L. Zhu, F. Ji, J. Yu, Y. Jin, W. Wang, Optimization of manifold mmicrochannel heat sink based on equivalent resistance model; optimization of manifold mmicrochannel heat sink based on equivalent resistance model, 2020. 10.1109/itherm45881.2020.9190529

[27]

Razavi "Review of advances in thermal spreading resistance problems" J. Thermophys. Heat. Trans. (2016) 10.2514/1.t4801

[28]

Muzychka "Thermal spreading resistance of eccentric heat sources on rectangular flux channels" J. Electron. Packag. (2003) 10.1115/1.1568125

[29]

Vermeersch "Influence of substrate thickness on thermal impedance of microelectronic structures" Microelectr. Reliab. (2007) 10.1016/j.microrel.2006.05.017

[30]

Nicolas Huc, Conjugate heat transfer, COMSOL (2014). https://www.comsol.com/blogs/conjugate-heat-transfer/?setlang=1 (accessed May 16, 2024).

[31]

K.K. Chu, P.C. Chao, J.A. Diaz, T. Yurovchak, B.J. Schmanski, C.T. Creamer, S. Sweetland, R.L. Kallaher, C. Mcgray, G.D. Via, J.D. Blevins, High-performance GaN-on-diamond HEMTs fabricated by low-temperature device transfer process, n.d.

[32]

Drummond "Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions" Int. J. Heat. Mass Transf. (2018) 10.1016/j.ijheatmasstransfer.2018.05.127

[33]

Lian "Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device" Microsyst. Nanoeng. (2022) 10.1038/s41378-022-00462-3

Metrics

6

Citations

33

References

Details

Published: Oct 01, 2024
Vol/Issue: 231
Pages: 125866
License: View

Authors

J

Jianyu Du

School of Integrated Circuits, Peking University, Beijing 100871, China

Hohai University

Hong Kong University of Science and Technology

C

Chi Zhang

AstraZeneca (Netherlands)

Cite This Article

Jianyu Du, Yuchi Yang, Huaiqiang Yu, et al. (2024). Optimization of embedded cooling for hotspots based on compound plate thermal spreading model. International Journal of Heat and Mass Transfer, 231, 125866. https://doi.org/10.1016/j.ijheatmasstransfer.2024.125866

Optimization of embedded cooling for hotspots based on compound plate thermal spreading model

You May Also Like