A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces

Tianli Feng; Zhe Cheng; Leighann Sarah Larkin; Mahesh R. Neupane

doi:10.1021/acsami.3c02507

journal article Jun 16, 2023

A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces

Tianli Feng

Zhe Cheng

Leighann Sarah Larkin Mahesh R. Neupane

ACS Applied Materials & Interfaces Vol. 15 No. 25 pp. 29655-29673 · American Chemical Society (ACS)

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Cited By

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Thermal boundary conductance and thermal conductivity strongly depend on nearby environment

Khalid Zobaid Adnan, Tianli Feng · 2024

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Metrics

79

Citations

180

References

Details

Published: Jun 16, 2023
Vol/Issue: 15(25)
Pages: 29655-29673
License: View

Authors

T

Tianli Feng

Department of Mechanical Engineering, University of Utah, Salt Lake City, Utah 84112, United States

Z

Zhe Cheng

School of Integrated Circuits and Frontiers Science Center for Nano-optoelectronics, Peking University, Beijing 100871, China

L

Leighann Sarah Larkin

Army Research Directorate (ARD), DEVCOM Army Research Laboratory, Adelphi, Maryland 20708, United States

M

Mahesh R. Neupane

Army Research Directorate (ARD), DEVCOM Army Research Laboratory, Adelphi, Maryland 20708, United States

Funding

Peking University

University of Utah

Cite This Article

Tianli Feng, Zhe Cheng, Leighann Sarah Larkin, et al. (2023). A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces. ACS Applied Materials & Interfaces, 15(25), 29655-29673. https://doi.org/10.1021/acsami.3c02507

A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces

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