journal article Mar 25, 2026

Conductive Reflow-Resistant Self-Healing Nanocomposite-Structured Adhesives for Reliable and Versatile Bioelectronic Interfaces

ACS Nano Vol. 20 No. 13 pp. 10331-10344 · American Chemical Society (ACS)
View at Publisher Save 10.1021/acsnano.5c18220
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References
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Published
Mar 25, 2026
Vol/Issue
20(13)
Pages
10331-10344
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Funding
National Research Foundation of Korea Award: RS-2024-00352352
National Research Council of Science and Technology Award: CRC23023-000
Ministry of Trade, Industry and Energy Award: RS-2022-00154781
Cite This Article
Dohyun Lim, Hyeonseo Cheon, Seung Hwan Jeon, et al. (2026). Conductive Reflow-Resistant Self-Healing Nanocomposite-Structured Adhesives for Reliable and Versatile Bioelectronic Interfaces. ACS Nano, 20(13), 10331-10344. https://doi.org/10.1021/acsnano.5c18220
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