Enhanced Electrical and Mechanical Properties of Silver Nanoplatelet-Based Conductive Features Direct Printed on a Flexible Substrate

Young-In Lee; Seil Kim; Seung-Boo Jung; Nosang V. Myung; Yong-Ho Choa

doi:10.1021/am401757y

journal article Jun 26, 2013

Enhanced Electrical and Mechanical Properties of Silver Nanoplatelet-Based Conductive Features Direct Printed on a Flexible Substrate

Young-In Lee Seil Kim Seung-Boo Jung Nosang V. Myung Yong-Ho Choa

ACS Applied Materials & Interfaces Vol. 5 No. 13 pp. 5908-5913 · American Chemical Society (ACS)

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Details

Published: Jun 26, 2013
Vol/Issue: 5(13)
Pages: 5908-5913

Authors

Y

Young-In Lee

Department of Chemical and Environmental Engineering and Center for Nanoscale Science and Engineering, University of California-Riverside, Riverside, California 92521, United States

S

Seil Kim

Department of Bionano Technology, Hanyang University, Ansan 426-791, Republic of Korea

S

Seung-Boo Jung

School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-476, Republic of Korea

N

Nosang V. Myung

Department of Chemical and Environmental Engineering and Center for Nanoscale Science and Engineering, University of California-Riverside, Riverside, California 92521, United States

Y

Yong-Ho Choa

Department of Bionano Technology, Hanyang University, Ansan 426-791, Republic of Korea

Cite This Article

Young-In Lee, Seil Kim, Seung-Boo Jung, et al. (2013). Enhanced Electrical and Mechanical Properties of Silver Nanoplatelet-Based Conductive Features Direct Printed on a Flexible Substrate. ACS Applied Materials & Interfaces, 5(13), 5908-5913. https://doi.org/10.1021/am401757y

Enhanced Electrical and Mechanical Properties of Silver Nanoplatelet-Based Conductive Features Direct Printed on a Flexible Substrate

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