Oxidation of Polycrystalline Copper Thin Films at Ambient Conditions

Ilia Platzman; Reuven Brener; Hossam Haick; Rina Tannenbaum

doi:10.1021/jp076981k

journal article Jan 01, 2008

Oxidation of Polycrystalline Copper Thin Films at Ambient Conditions

Ilia Platzman

Reuven Brener Hossam Haick

Rina Tannenbaum

The Journal of Physical Chemistry C Vol. 112 No. 4 pp. 1101-1108 · American Chemical Society (ACS)

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Details

Published: Jan 01, 2008
Vol/Issue: 112(4)
Pages: 1101-1108

Authors

I

Ilia Platzman

Department of Chemical Engineering, Solid State Institute, and Russell Berrie Nanotechnology Institute, TechnionIsrael Institute of Technology, Haifa 32000, Israel, and School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

R

Reuven Brener

Department of Chemical Engineering, Solid State Institute, and Russell Berrie Nanotechnology Institute, TechnionIsrael Institute of Technology, Haifa 32000, Israel, and School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

H

Hossam Haick

Department of Chemical Engineering, Solid State Institute, and Russell Berrie Nanotechnology Institute, TechnionIsrael Institute of Technology, Haifa 32000, Israel, and School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

R

Rina Tannenbaum

Department of Chemical Engineering, Solid State Institute, and Russell Berrie Nanotechnology Institute, TechnionIsrael Institute of Technology, Haifa 32000, Israel, and School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332

Cite This Article

Ilia Platzman, Reuven Brener, Hossam Haick, et al. (2008). Oxidation of Polycrystalline Copper Thin Films at Ambient Conditions. The Journal of Physical Chemistry C, 112(4), 1101-1108. https://doi.org/10.1021/jp076981k

Oxidation of Polycrystalline Copper Thin Films at Ambient Conditions

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