Effect of Layer-by-Layer Electrostatic Assemblies on the Surface Potential and Current Voltage Characteristic of Metal−Insulator−Semiconductor Structures

D. A. Gorin; A. M. Yashchenok; A. O. Manturov; T. A. Kolesnikova; H. Möhwald

doi:10.1021/la901379d

journal article Oct 01, 2009

Effect of Layer-by-Layer Electrostatic Assemblies on the Surface Potential and Current Voltage Characteristic of Metal−Insulator−Semiconductor Structures

D. A. Gorin A. M. Yashchenok A. O. Manturov T. A. Kolesnikova H. Möhwald

Langmuir Vol. 25 No. 21 pp. 12529-12534 · American Chemical Society (ACS)

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Metrics

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References

Details

Published: Oct 01, 2009
Vol/Issue: 25(21)
Pages: 12529-12534

Authors

D

D. A. Gorin

Department of Interfaces, Max-Planck Institute of Colloids and Interfaces, Golm/Potsdam D14476, Germany; Faculty of Nano- and Biomedical Technologies, Saratov State University, Saratov 410012, Russia

A

A. M. Yashchenok

Faculty of Nano- and Biomedical Technologies, Saratov State University, Saratov 410012, Russia

A

A. O. Manturov

Faculty of Electronics Engineering and Instrument-Making, Saratov State Technical University, Saratov 410054, Russia

T

T. A. Kolesnikova

Faculty of Nano- and Biomedical Technologies, Saratov State University, Saratov 410012, Russia

H

H. Möhwald

Department of Interfaces, Max-Planck Institute of Colloids and Interfaces, Golm/Potsdam D14476, Germany

Cite This Article

D. A. Gorin, A. M. Yashchenok, A. O. Manturov, et al. (2009). Effect of Layer-by-Layer Electrostatic Assemblies on the Surface Potential and Current Voltage Characteristic of Metal−Insulator−Semiconductor Structures. Langmuir, 25(21), 12529-12534. https://doi.org/10.1021/la901379d

Effect of Layer-by-Layer Electrostatic Assemblies on the Surface Potential and Current Voltage Characteristic of Metal−Insulator−Semiconductor Structures

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