Bottom-up assembly of metallic germanium

Giordano Scappucci; Wolfgang M. Klesse; LaReine A. Yeoh; Damien J. Carter; Oliver Warschkow; Nigel A. Marks; David L. Jaeger; Giovanni Capellini; Michelle Y. Simmons; Alexander R. Hamilton

doi:10.1038/srep12948

journal article Open Access Aug 10, 2015

Bottom-up assembly of metallic germanium

Wolfgang M. Klesse LaReine A. Yeoh Damien J. Carter Oliver Warschkow Nigel A. Marks David L. Jaeger Giovanni Capellini Michelle Y. Simmons Alexander R. Hamilton

Scientific Reports Vol. 5 No. 1 · Springer Science and Business Media LLC

View at Publisher Save 10.1038/srep12948

Abstract

AbstractExtending chip performance beyond current limits of miniaturisation requires new materials and functionalities that integrate well with the silicon platform. Germanium fits these requirements and has been proposed as a high-mobility channel material, a light emitting medium in silicon-integrated lasers and a plasmonic conductor for bio-sensing. Common to these diverse applications is the need for homogeneous, high electron densities in three-dimensions (3D). Here we use a bottom-up approach to demonstrate the 3D assembly of atomically sharp doping profiles in germanium by a repeated stacking of two-dimensional (2D) high-density phosphorus layers. This produces high-density (1019 to 1020 cm−3) low-resistivity (10−4Ω · cm) metallic germanium of precisely defined thickness, beyond the capabilities of diffusion-based doping technologies. We demonstrate that free electrons from distinct 2D dopant layers coalesce into a homogeneous 3D conductor using anisotropic quantum interference measurements, atom probe tomography and density functional theory.

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Details

Published: Aug 10, 2015
Vol/Issue: 5(1)
License: View

Authors

Nanochemistry Research Institute, Department of Chemistry, Curtin University of Technology, GPO Box U1987, Perth, WA, Australia, 6845; iVEC, 26 Dick Perry Avenue, Technology Park, Kensington, WA, Australia 6151

School of Physics, University of New South Wales Centre for Quantum Computation and Communication Technology (CQC 2 T), , Sydney 2052, Australia

A

Alexander R. Hamilton

Cite This Article

Giordano Scappucci, Wolfgang M. Klesse, LaReine A. Yeoh, et al. (2015). Bottom-up assembly of metallic germanium. Scientific Reports, 5(1). https://doi.org/10.1038/srep12948

Bottom-up assembly of metallic germanium

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