Encapsulation of integrated circuits

M.L. White

doi:10.1109/proc.1969.7344

journal article Jan 01, 1969

Encapsulation of integrated circuits

M.L. White

Proceedings of the IEEE Vol. 57 No. 9 pp. 1610-1615 · Institute of Electrical and Electronics Engineers (IEEE)

View at Publisher Save 10.1109/proc.1969.7344

Topics

No keywords indexed for this article. Browse by subject →

References

12

[1]

peck Semiconductor Reliability (1961)

[2]

pritchard Electrical Characteristics of Transistors (1967)

[3]

peck "A review of step-stress testing" Bell Lab Rec (1964)

[4]

10.1109/t-ed.1968.16180

[5]

10.1111/j.1749-6632.1968.tb20277.x

[6]

zierdt "Procurement specification techniques for high-reliability transistors" Proc Ann Symp Reliability (1967)

[7]

10.1021/j100804a022

[8]

zierdt "Procurement specification techniques for high reliability transistors" Proc Ann Symp Reliability (1967)

[9]

clark "Wobble table for thermocompression bonding beam-lead silicon integrated circuits" Proc Wescon/95 (1968)

[10]

eleftherion "Assembling beam-lead sealed-junction integrated circuit packages" Western Electric Engrg (1967)

[11]

mayo "Integrated circuits for a digital transmission system" Bell Lab Rec (1966)

[12]

forster "Beam-lead sealed-junction integrated circuits" Bell Lab Rec (1966)

Cited By

63

Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: a comparative long-term ageing study

C Lamont, T Grego · 2021

Journal of Neural Engineering

Metrics

63

Citations

12

References

Details

Published: Jan 01, 1969
Vol/Issue: 57(9)
Pages: 1610-1615
License: View

Authors

M

M.L. White

Cite This Article

M.L. White (1969). Encapsulation of integrated circuits. Proceedings of the IEEE, 57(9), 1610-1615. https://doi.org/10.1109/proc.1969.7344

Encapsulation of integrated circuits

You May Also Like