journal article Jan 01, 1969

Encapsulation of integrated circuits

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References
12
[1]
peck Semiconductor Reliability (1961)
[2]
pritchard Electrical Characteristics of Transistors (1967)
[3]
peck "A review of step-stress testing" Bell Lab Rec (1964)
[6]
zierdt "Procurement specification techniques for high-reliability transistors" Proc Ann Symp Reliability (1967)
[8]
zierdt "Procurement specification techniques for high reliability transistors" Proc Ann Symp Reliability (1967)
[9]
clark "Wobble table for thermocompression bonding beam-lead silicon integrated circuits" Proc Wescon/95 (1968)
[10]
eleftherion "Assembling beam-lead sealed-junction integrated circuit packages" Western Electric Engrg (1967)
[11]
mayo "Integrated circuits for a digital transmission system" Bell Lab Rec (1966)
[12]
forster "Beam-lead sealed-junction integrated circuits" Bell Lab Rec (1966)
Metrics
63
Citations
12
References
Details
Published
Jan 01, 1969
Vol/Issue
57(9)
Pages
1610-1615
License
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Cite This Article
M.L. White (1969). Encapsulation of integrated circuits. Proceedings of the IEEE, 57(9), 1610-1615. https://doi.org/10.1109/proc.1969.7344
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