Electroless Grafting of Polymer Insulation Layers in Through-Silicon Vias

Yang Liu; Yutong Han; Junhong Zhang; Junpeng He; Tao Hang; Liming Gao; Yunwen Wu; Ming Li

doi:10.1149/2.0141910jss

journal article Jan 01, 2019

Electroless Grafting of Polymer Insulation Layers in Through-Silicon Vias

Yang Liu

Junpeng He Tao Hang

ECS Journal of Solid State Science and Technology Vol. 8 No. 10 pp. P591-P595 · The Electrochemical Society

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References

Details

Published: Jan 01, 2019
Vol/Issue: 8(10)
Pages: P591-P595

Authors

Southwest University

University of Science and Technology of China

Funding

National Natural Science Foundation of China Award: 61774105

National Basic Research Program of China Award: 2015CB057200

Cite This Article

Yang Liu, Yutong Han, Junhong Zhang, et al. (2019). Electroless Grafting of Polymer Insulation Layers in Through-Silicon Vias. ECS Journal of Solid State Science and Technology, 8(10), P591-P595. https://doi.org/10.1149/2.0141910jss

Electroless Grafting of Polymer Insulation Layers in Through-Silicon Vias

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