Low‐Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

Wei Guo; Zhi Zeng; Xiaoying Zhang; Peng Peng; Shanping Tang

doi:10.1155/2015/897142

journal article Open Access Jan 01, 2015

Low‐Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

Wei Guo

Zhi Zeng

Xiaoying Zhang

Peng Peng

Shanping Tang

Journal of Nanomaterials Vol. 2015 No. 1 · Wiley

View at Publisher Save 10.1155/2015/897142

Abstract

Ag nanoparticles (NPs) with about 40 nm diameter covered with 5–8 nm organic shell were prepared by chemical reduction reaction. The thermal characteristics of Ag nanoparticle (NP) paste were measured by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The low‐temperature sintering bonding processes using Ag NP paste were carried out at the temperature range of 150–350°C for 5 min under the pressure of 3 MPa. The microstructures of the sintered joint and the fracture morphology were evaluated by scanning electron microscopy (SEM). The shear strength was used to evaluate the mechanical property of the sintered joint. TGA‐DSC test showed that the Ag content is approximately 95.5 mass% in Ag NP paste. The average shear strength of the joint fabricated at 250°C for 5 min under the pressure of 3 MPa was about 28 MPa, which could meet the requirements of electronics packaging working at high temperature. The joint shear strength increased with the increase of the sintering temperature due to much denser sintered Ag NPs and more comprehensive metallurgical bonds formed in the joint.

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References

34

[1]

Tummala R. R. (1997)

[2]

10.1063/1.113975

[3]

10.1016/j.microrel.2006.07.090

[4]

10.1007/978-0-387-48433-4_4

[5]

Puttlitz K. J. (2007)

[6]

10.1126/science.1110168

[7]

10.1016/0254-0584(94)90169-4

[8]

10.1109/55.215110

[9]

10.4028/www.scientific.net/msf.457-460.963

[10]

10.1103/physrevb.62.10548

[11]

10.1016/j.ssc.2004.03.033

[12]

10.1039/b911535h

[13]

10.1016/j.actamat.2005.01.047

[14]

Groza J. R. "Nanostructured bulk solids by field activated sintering" Reviews on Advanced Materials Science (2003)

[15]

10.1016/j.microrel.2011.04.015

[16]

10.1109/tcapt.2005.853167

[17]

YanJ. ZouG. WangX. BaiH. MuF. andWuA. Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application Proceedings of the 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP ′11) August 2011 Shanghai China IEEE 1–6 https://doi.org/10.1109/icept.2011.6066831 2-s2.0-81355142570. 10.1109/icept.2011.6066831

[18]

10.1007/s11664-005-0229-8

[19]

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

Jianfeng Li, Christopher Mark Johnson, Cyril Buttay et al.

Journal of Materials Processing Technology 10.1016/j.jmatprotec.2014.08.002

[20]

10.1016/j.scriptamat.2013.08.031

[21]

10.1016/j.jallcom.2011.10.092

[22]

10.1002/adma.200600589

[23]

10.1016/j.microrel.2014.07.004

[24]

10.1016/j.matchemphys.2014.06.025

[25]

10.1039/c2jm32789a

[26]

10.1016/j.scriptamat.2012.02.037

[27]

Shape-Controlled Synthesis of Gold and Silver Nanoparticles

Yugang Sun, Younan Xia

Science 10.1126/science.1077229

[28]

10.1016/j.apsusc.2012.09.117

[29]

10.1016/j.apsusc.2011.01.090

[30]

10.1016/j.apcatb.2013.07.042

[31]

Li J. (2010)

[32]

10.2174/1876531901103010070

[33]

10.1016/j.microc.2008.12.007

[34]

10.1021/jp311541c

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34

References

Details

Published: Jan 01, 2015
Vol/Issue: 2015(1)
License: View

Authors

W

Wei Guo

North China University of Technology

University of Science and Technology

P

Peng Peng

From the State Key Laboratory of Respiratory Disease, National Clinical Research Center for Respiratory Disease, Guangzhou Institute of Respiratory Health, First Affiliated Hospital of Guangzhou Medical University (W.G., W.L., J.H., R.C., C.T., T.W., S.L., Jin-lin Wang, N.Z., J.H., W.L.), the Departments of Thoracic Oncology (W.L.), Thoracic Surgery and Oncology (J.H.), and Emergency Medicine (Z.L.), First Affiliated Hospital of Guangzhou Medical University, and Guangzhou Eighth People’s Hospital,...

S

Shanping Tang

Funding

Fundamental Research Funds for the Central University Award: 30420100042

International Science and Technology Cooperation Program of China Award: 30420100042

Cite This Article

Wei Guo, Zhi Zeng, Xiaoying Zhang, et al. (2015). Low‐Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging. Journal of Nanomaterials, 2015(1). https://doi.org/10.1155/2015/897142

Low‐Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

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