4H-SiC wafer slicing by using femtosecond laser double-pulses

Eunho Kim; Yasuhiko Shimotsuma; Masaaki Sakakura; Kiyotaka Miura

doi:10.1364/ome.7.002450

journal article Jun 15, 2017

4H-SiC wafer slicing by using femtosecond laser double-pulses

Eunho Kim

Yasuhiko Shimotsuma Masaaki Sakakura Kiyotaka Miura

Optical Materials Express Vol. 7 No. 7 pp. 2450 · Optica Publishing Group

View at Publisher Save 10.1364/ome.7.002450

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Metrics

89

Citations

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References

Details

Published: Jun 15, 2017
Vol/Issue: 7(7)
Pages: 2450
License: View

Authors

Cite This Article

Eunho Kim, Yasuhiko Shimotsuma, Masaaki Sakakura, et al. (2017). 4H-SiC wafer slicing by using femtosecond laser double-pulses. Optical Materials Express, 7(7), 2450. https://doi.org/10.1364/ome.7.002450

4H-SiC wafer slicing by using femtosecond laser double-pulses

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