Analysis of Wire-Bonded Micro Heat Pipe Arrays

Y. X. Wang; G. P. Peterson

doi:10.2514/2.6711

journal article Jul 01, 2002

Analysis of Wire-Bonded Micro Heat Pipe Arrays

Y. X. Wang

G. P. Peterson

Journal of Thermophysics and Heat Transfer Vol. 16 No. 3 pp. 346-355 · American Institute of Aeronautics and Astronautics (AIAA)

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Details

Published: Jul 01, 2002
Vol/Issue: 16(3)
Pages: 346-355

Authors

Y

Y. X. Wang

Rensselaer Polytechnic Institute, Troy, New York 12180

G

G. P. Peterson

Rensselaer Polytechnic Institute, Troy, New York 12180

Cite This Article

Y. X. Wang, G. P. Peterson (2002). Analysis of Wire-Bonded Micro Heat Pipe Arrays. Journal of Thermophysics and Heat Transfer, 16(3), 346-355. https://doi.org/10.2514/2.6711

Analysis of Wire-Bonded Micro Heat Pipe Arrays

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