journal article
Open Access
Jun 21, 2018
An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection
Abstract
The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.
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Showing 50 of 142 references
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References
Details
- Published
- Jun 21, 2018
- Vol/Issue
- 18(7)
- Pages
- 1981
- License
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Authors
Funding
National Research Foundation of Korea
Award: 2017R1A5A1014883
Cite This Article
Pouria Aryan, Santhakumar Sampath, Hoon Sohn (2018). An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection. Sensors, 18(7), 1981. https://doi.org/10.3390/s18071981
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