journal article Sep 01, 2019

Brittle-to-ductile transition in elliptical vibration-assisted diamond cutting of reaction-bonded silicon carbide

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References
30
[1]
Goel "The current understanding on the diamond machining of silicon carbide" J Appl Phys (2014)
[2]
Goel "Brittle-ductile transition during diamond turning of single crystal silicon carbide" Int J Mach Tool Manuf (2013) 10.1016/j.ijmachtools.2012.09.001
[3]
Yan "Mechanism for material removal in diamond turning of reaction-boned silicon carbide" Int J Mach Tool Manuf (2009) 10.1016/j.ijmachtools.2008.12.007
[4]
Shamoto "Study on elliptical vibration cutting" CIRP Ann-Manuf Techn (1994) 10.1016/s0007-8506(07)62158-1
[5]
Zhang "Advanced applications of elliptical vibration cutting in micro/nanomachining of difficult-to-cut materials" (2019)
[6]
Zhang "A model to predict the critical undeformed chip thickness in vibration-assisted machining of brittle materials" Int J Mach Tool Manuf (2013) 10.1016/j.ijmachtools.2013.03.006
[7]
Zhu "Rotary spatial vibration-assisted diamond cutting of brittle materials" Precis Eng (2016) 10.1016/j.precisioneng.2015.12.007
[8]
Shamoto "Development of elliptical vibration cutting technology and its application to Ultraprecision/Micro machining of Hard/Brittle materials" Adv Mater Res (2009) 10.4028/www.scientific.net/amr.69-70.133
[9]
Zhang "Sculpturing of single crystal silicon microstructures by elliptical vibration cutting" J Manuf Process (2017) 10.1016/j.jmapro.2017.09.003
[10]
Marinescu "Handbook of advanced ceramics machining, chapter 3" (2007)
[11]
Shamoto "Analysis of 3D elliptical vibration cutting with thin shear plane model" CIRP Ann-Manuf Techn (2008) 10.1016/j.cirp.2008.03.073
[12]
Suzuki "Elliptical vibration cutting of tungsten alloy molds for optical glass parts" CIRP Ann-Manuf Techn (2007) 10.1016/j.cirp.2007.05.032
[13]
Zhu (2015)
[14]
Ji "Finite element analysis and simulation about microgrinding of SiC" J Nanomater (2015)
[15]
T. Ando, K. Sato, M. Shikida, T. Yoshioka, Y. Yoshikawa, T. Kawabata, Orientation-dependent fracture strain in single-crystal silicon beams under uniaxial tensile conditions, Proc. of the IEEE Int. Symp. on Micromechatronics and Human Science. 55-60. 10.1109/mhs.1997.768857
[16]
Wang "Fracture strain of SiC nanowires and direct evidence of electron-beam induced amorphisation in the strained nanowires" Small (2015) 10.1002/smll.201402202
[17]
Pittari "The rate-dependent fracture toughness of silicon carbide-and boron carbide-based ceramics" J Eur Ceram Soc (2015) 10.1016/j.jeurceramsoc.2015.08.027
[18]
Li "Measurement for fracture toughness of single crystal silicon film with tensile test" Sens Actuators A-Phys (2005) 10.1016/j.sna.2003.10.063
[19]
Zhang "Experimental study on ultrasonic elliptical vibration cutting of hardened steel using PCD tools" J MATER PROCESS TECHnol (2011) 10.1016/j.jmatprotec.2011.05.015
[20]
Bai "Analysis and modeling of force in orthogonal elliptical vibration cutting" Int J Adv Manuf Technol (2016) 10.1007/s00170-015-7645-6
[21]
Nath "Modeling of the effect of machining parameters on maximum thickness of cut in ultrasonic elliptical vibration cutting" J Manuf Sci E-T. ASME (2011) 10.1115/1.4003118
[22]
Zhang "A study on ultrasonic elliptical vibration cutting of hardened steel using PCD tools" (2010)
[23]
Arcona "An empirical tool force model for precision machining" J Manuf Sci E-T ASME (1998) 10.1115/1.2830209
[24]
Arif "A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials" Int J Mach Tool Manuf (2013) 10.1016/j.ijmachtools.2012.08.005
[25]
Bifano "Specific grinding energy as an in-process control variable for ductile-regime grinding" Precis Eng (1991) 10.1016/0141-6359(91)90003-2
[26]
Marshall (1986)
[27]
Zhang "An analytical force model for orthogonal elliptical vibration cutting technique" J Manuf Process (2012) 10.1016/j.jmapro.2012.05.006
[28]
Merchant "Mechanics of the metal cutting process. I. Orthogonal cutting and a type 2 chip" J Appl Phys (1945) 10.1063/1.1707586
[29]
Matsuo "The relationship between tensile strength and flaw-size of silicon carbide single fibers" Adv Compos Mater (1992) 10.1163/156855192x00206
[30]
Lai "Modelling and analysis of micro scale milling considering size effect, micro cutter edge radius and minimum chip thickness" Int J Mach Tool Manuf (2008) 10.1016/j.ijmachtools.2007.08.011
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Details
Published
Sep 01, 2019
Vol/Issue
45
Pages
670-681
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Funding
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Science Challenge Project
State Key Lab of Digital Manufacturing Equipment and Technology
Cite This Article
Junjie Zhang, La Han, Jianguo Zhang, et al. (2019). Brittle-to-ductile transition in elliptical vibration-assisted diamond cutting of reaction-bonded silicon carbide. Journal of Manufacturing Processes, 45, 670-681. https://doi.org/10.1016/j.jmapro.2019.08.005