Development of high-temperature solders: Review

Guang Zeng; Stuart McDonald; Kazuhiro Nogita

doi:10.1016/j.microrel.2012.02.018

journal article Jul 01, 2012

Development of high-temperature solders: Review

Guang Zeng

Stuart McDonald

Kazuhiro Nogita

Microelectronics Reliability Vol. 52 No. 7 pp. 1306-1322 · Elsevier BV

View at Publisher Save 10.1016/j.microrel.2012.02.018

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Details

Published: Jul 01, 2012
Vol/Issue: 52(7)
Pages: 1306-1322
License: View

Authors

G

Guang Zeng

From the State Key Laboratory of Respiratory Disease, National Clinical Research Center for Respiratory Disease, Guangzhou Institute of Respiratory Health, First Affiliated Hospital of Guangzhou Medical University (W.G., W.L., J.H., R.C., C.T., T.W., S.L., Jin-lin Wang, N.Z., J.H., W.L.), the Departments of Thoracic Oncology (W.L.), Thoracic Surgery and Oncology (J.H.), and Emergency Medicine (Z.L.), First Affiliated Hospital of Guangzhou Medical University, and Guangzhou Eighth People’s Hospital,...

Cite This Article

Guang Zeng, Stuart McDonald, Kazuhiro Nogita (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52(7), 1306-1322. https://doi.org/10.1016/j.microrel.2012.02.018

Development of high-temperature solders: Review

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