Extreme ultraviolet resist materials for sub-7 nm patterning

Li Li; Xuan Liu; Shyam Pal; Shulan Wang; Christopher K. Ober; Emmanuel P. Giannelis

doi:10.1039/c7cs00080d

journal article Jan 01, 2017

Extreme ultraviolet resist materials for sub-7 nm patterning

Li Li

Xuan Liu

Shyam Pal Shulan Wang

Christopher K. Ober Emmanuel P. Giannelis

Chemical Society Reviews Vol. 46 No. 16 pp. 4855-4866 · Royal Society of Chemistry (RSC)

View at Publisher Save 10.1039/c7cs00080d

Abstract

Continuous ongoing development of dense integrated circuits requires significant advancements in nanoscale patterning technology.

Topics

No keywords indexed for this article. Browse by subject →

References

50

[1]

Pimpin Eng. J. (2011) 10.4186/ej.2012.16.1.37

[2]

Bain Angew. Chem., Int. Ed. Engl. (1989) 10.1002/anie.198905061

[3]

Guo Adv. Mater. (2007) 10.1002/adma.200600882

[4]

Piner Science (1999) 10.1126/science.283.5402.661

[5]

P. De Bisschop , B.Laenens, K.Iwase, T.Yao, M.Dusa and M. C.Smayling, SPIE Advanced Lithography, 2011

[6]

Schuegraf IEEE J. Electron Devices Soc. (2013) 10.1109/jeds.2013.2271582

[7]

Patolsky Science (2006) 10.1126/science.1128640

[8]

Suh Nat. Nanotechnol. (2017) 10.1038/nnano.2017.34

[9]

Grigorescu Nanotechnology (2009) 10.1088/0957-4484/20/29/292001

[10]

Inoue Adv. Opt. Technol. (2012) 10.1515/aot-2012-0029

[11]

Wu Appl. Phys. Rev. (2014) 10.1063/1.4863412

[12]

Mojarad Sci. Rep. (2015) 10.1038/srep09235

[13]

Higgins Jpn. J. Appl. Phys. (2011) 10.7567/jjap.50.036504

[14]

E. S. Putna , T. R.Younkin, M.Chandhok and K.Frasure, SPIE Advanced Lithography, 2009

[15]

Gronheid J. Photopolym. Sci. Technol. (2008) 10.2494/photopolymer.21.429

[16]

S. Shigaki , R.Onishi and R.Sakamoto, SPIE Advanced Lithography, 2015

[17]

Zong J. Micromech. Microeng. (2013) 10.1088/0960-1317/23/3/035038

[18]

Resist Materials and Processes for Extreme Ultraviolet Lithography

Toshiro Itani, Takahiro Kozawa

Japanese Journal of Applied Physics 2013 10.7567/jjap.52.010002

[19]

Thackeray J. Micro/Nanolithogr., MEMS, MOEMS (2011) 10.1117/1.3616067

[20]

Kozawa J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom. (2007) 10.1116/1.2794063

[21]

T. Fujii , S.Matsumaru, T.Yamada, Y.Komuro, D.Kawana and K.Ohmori, SPIE Advanced Lithography, 2016

[22]

Kozawa Jpn. J. Appl. Phys. (2015) 10.7567/jjap.54.036507

[23]

Fallica J. Micro/Nanolithogr., MEMS, MOEMS (2016) 10.1117/1.jmm.15.3.033506

[24]

Yamamoto Appl. Phys. Express (2008) 10.1143/apex.1.047001

[25]

Fukuyama Jpn. J. Appl. Phys. (2009) 10.1143/jjap.48.06fc03

[26]

S. Grzeskowiak , A.Narasimhan, L.Wisehart, J.Schad, M.Neisser, L. E.Ocola, R. L.Brainard and G.Denbeaux, SPIE Advanced Lithography, 2016

[27]

Furukawa Appl. Phys. Express (2008) 10.1143/apex.1.067001

[28]

M. Shirakawa , T.Omatsu, K.Ou, Y.Yonekuta, N.Hatakeyama, D.Asakawa, T.Yakushiji, M.Fujita and N.Muraki, SPIE Advanced Lithography, 2016

[29]

S. Tarutani , W.Nihashi, S.Hirano, N.Yokokawa and H.Takizawa, SPIE Advanced Lithography, 2013

[30]

H. Tsubaki , W.Nihashi, T.Tsuchihashi, T.Fujimori, M.Momota and T.Goto, SPIE Advanced Lithography, 2015

[31]

De Silva Adv. Mater. (2008) 10.1002/adma.200800763

[32]

Tully Adv. Mater. (2000) 10.1002/1521-4095(200008)12:15<1118::aid-adma1118>3.0.co;2-i

[33]

Dai Chem. Mater. (2006) 10.1021/cm052452m

[34]

D. P. Green , V.Jain, B.Bailey, M.Wagner, M. B.Clark, D.Valeri and S.Lakso, SPIE Advanced Lithography, 2013

[35]

Kudo J. Photopolym. Sci. Technol. (2012) 10.2494/photopolymer.25.587

[36]

Bratton Chem. Mater. (2007) 10.1021/cm062967t

[37]

Lawson J. Vac. Sci. Technol., B: Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom. (2010)

[38]

Li Nanoscale (2016) 10.1039/c5nr07334k

[39]

Lim Nanotechnology (2010) 10.1088/0957-4484/21/28/285303

[40]

Ganesan ACS Nano (2012) 10.1021/nn204405k

[41]

Li Chem. Mater. (2015) 10.1021/acs.chemmater.5b01506

[42]

Yeh J. Mater. Chem. C (2017) 10.1039/c6tc05201k

[43]

J. K. Stowers , A.Telecky, M.Kocsis, B. L.Clark, D. A.Keszler, A.Grenville, C. N.Anderson and P. P.Naulleau, SPIE Advanced Lithography, 2011

[44]

Oleksak ACS Appl. Mater. Interfaces (2014) 10.1021/am405463u

[45]

Reddy RSC Adv. (2016) 10.1039/c6ra10575k

[46]

A. Grenville , J. T.Anderson, B. L.Clark, P.De Schepper, J.Edson, M.Greer, K.Jiang, M.Kocsis, S. T.Meyers and J. K.Stowers, SPIE Advanced Lithography, 2015

[47]

Passarelli J. Micro/Nanolithogr., MEMS, MOEMS (2015) 10.1117/1.jmm.14.4.043503

[48]

Satyanarayana ACS Appl. Mater. Interfaces (2014) 10.1021/am405905p

[49]

S. Takei , M.Hanabata, A.Oshima, M.Kashiwakura, T.Kozawa and S.Tagawa, SPIE Advanced Lithography, 2016

[50]

Kulmala Microelectron. Eng. (2016) 10.1016/j.mee.2016.02.024

Cited By

307

Transmission Electron Microscopy Unraveled Ionic Oxygen-Affinity Engineering of Metal Oxo Clusters with Extreme Ultraviolet Lithography Activity

Fangfang Liu, Yue Sun · 2026

ACS Nano

Ultralow line edge roughness of hybrid multilayer Extreme ultraviolet resist with vertical molecular wire structure

Jaehyuk Lee, Hyeonseok Ji · 2025

Materials Today

High quality nanogratings far beyond diffraction limits on silicon efficiently fabricated using femtosecond laser dual-beam interference direct writing

Kang Li, Ruozhong Han · 2025

Optics & Laser Technology

Suppressing of secondary electron diffusion for high-precision nanofabrication

Qianqian Wang, Yuting Zhou · 2023

Materials Today

Trends in photoresist materials for extreme ultraviolet lithography: A review

Xiaolin Wang, Peipei Tao · 2023

Materials Today

Theoretical Insights into the Solubility Polarity Switch of Metal–Organic Nanoclusters for Nanoscale Patterning

Qianqian Wang, Michaela Vockenhuber · 2023

Small Methods

The 2022 Plasma Roadmap: low temperature plasma science and technology

I Adamovich, S AGARWAL · 2022

Journal of Physics D: Applied Physi...

Molecular Glass Resists Based on Tetraphenylsilane Derivatives: Effect of Protecting Ratios on Advanced Lithography

Yake Wang, Jinping Chen · 2022

ACS Omega

Key Role of Very Low Energy Electrons in Tin-Based Molecular Resists for Extreme Ultraviolet Nanolithography

Ivan Bespalov, Yu Zhang · 2020

ACS Applied Materials & Interfa...

Unravelling the effect of fluorinated ligands in hybrid EUV photoresists by X-ray spectroscopy

Lianjia Wu, Ivan Bespalov · 2020

Journal of Materials Chemistry C

Molecular Glass Resists Based on 9,9′-Spirobifluorene Derivatives: Pendant Effect and Comprehensive Evaluation in Extreme Ultraviolet Lithography

Jinping Chen, Qingshan Hao · 2019

ACS Applied Polymer Materials

Metrics

307

Citations

50

References

Details

Published: Jan 01, 2017
Vol/Issue: 46(16)
Pages: 4855-4866

Authors

L

Li Li

Department of Advanced Technology Development; GlobalFoundries; Malta; USA

X

Xuan Liu

Department of Advanced Technology Development; GlobalFoundries; Malta; USA

S

Shyam Pal

Department of Advanced Technology Development; GlobalFoundries; Malta; USA

S

Shulan Wang

Department of Chemistry; Northeastern University; Shenyang; China

C

Christopher K. Ober

Department of Materials Science and Engineering; Cornell University; Ithaca; USA

E

Emmanuel P. Giannelis

Department of Materials Science and Engineering; Cornell University; Ithaca; USA

Cite This Article

Li Li, Xuan Liu, Shyam Pal, et al. (2017). Extreme ultraviolet resist materials for sub-7 nm patterning. Chemical Society Reviews, 46(16), 4855-4866. https://doi.org/10.1039/c7cs00080d

Extreme ultraviolet resist materials for sub-7 nm patterning

You May Also Like